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Computer Sciences

AI agents struggle to perform original scientific research

Among the many predictions about the future of artificial intelligence is that models will one day be able to conduct scientific research on their own, leaving humans out of the equation. Already, they can write code, run ...

Electronics & Semiconductors

Built-in charge could replace chemical reagents in gold recovery from electronic waste

Recovering valuable metals from electronic waste, mining streams and industrial waste typically requires large quantities of chemical reagents. Researchers at the University of Illinois Urbana-Champaign have developed a new ...

Security

Brief physical access may let attackers alter Boeing 737 flight instructions

Physical access to an aircraft has not typically been considered a cybersecurity risk—but it should be, according to a team of computer scientists at the University of California San Diego. In a paper presented Aug. 13 at ...

Engineering

Levitated spinning device could help navigation when GPS is unavailable

Researchers at the A*STAR Quantum Innovation Center (A*STAR Q.InC), part of the Research, Innovation and Enterprise (RIE) Flagship in Semiconductors, have developed a levitated, millimeter-scale rotor that continued spinning ...

Technology news

Robotics

Simple robot design exceeds human hand in some core motions

The human hand is a dexterous and versatile machine. Scientists have conventionally tried to replicate these traits in robots by copying the biological mechanics of the hand, resulting in complex and difficult-to-control ...

Electronics & Semiconductors

An energy storage device designed to be recycled

Smartwatches, phones and even some drones rely on lightweight, rechargeable energy storage systems. Once those devices wear out, many end up as electronic waste. Now, researchers reporting in ACS Energy Letters have developed ...

Hardware

A novel chip-on-wafer platform for next-generation AI hardware

A new semiconductor integration platform developed at the Institute of Science Tokyo combines advanced chip packaging with high-density interconnects and improved thermal management. This combination of three complementary ...